Bridging the Digital Divide

In today’s fast-paced world, access to technology is essential for students pursuing degrees in engineering and computer science. At Oakland University, the Engineering and Computer Science Laptop Program (ECLP) is leveling the playing field by providing economically challenged students with the tools they need to thrive. 

ECLP was launched in the fall of 2023 by the School of Engineering and Computer Science, in collaboration with T-Mobile, to offer free laptops and Internet access to eligible OU undergraduates, prioritizing freshmen and sophomores. In addition to being enrolled in a SECS major, all applicants have to be part of an underrepresented minority population or first-generation college students and Pell eligible. 

“This initiative, aimed to bridge the digital divide and furnish students with the technology essential for academic success, reflects our strong commitment to improving educational opportunities for all students. Eleven students received a free laptop, as part of this program, last year. Those who maintain good academic standing can keep the laptop upon graduation, ensuring they are equipped for both their educational and professional journeys,” says Louay M. Chamra, Ph.D., dean of the School of Engineering and Computer Science.

In 2024, five more SECS students can benefit from the Engineering and Computer Science Laptop Program, thanks to a generous sponsorship from Rheinmetall, a multinational powerhouse and global leader in defense and technology. By sponsoring ECLP, Rheinmetall is extending its dedication to the company’s long-standing ethos of responsibility, innovation and excellence.

As the company explains, “Rheinmetall is driven by a passion for technology and pledges to take responsibility in a changing world by fostering growth for the next generation of engineers who will one day drive advancement in the sectors of technology and defense. By supporting the OU Engineering and Computer Science Laptop Program, Rheinmetall aims to ensure that students, [who are] eager to learn, have access to the technology they need to excel in their studies, regardless of their financial background.”

Rheinmetall’s sponsorship — which not only includes a computer, but an additional $720 in wireless data cards from T-Mobile for four years as well — is an investment in the future of engineering education​. It enables students to participate fully in online resources, virtual classes and other essential educational activities, opening doors to a brighter future. 

Visit for more information on ECLP and instructions to apply.

Anisul Hoque, Dominic Najjar, Dominic Wilkerson, Mashud Alfoyez, Haseeb Ahmed, Hussam Omairat, Simon Kauffman, Peter Younan, Austin Mabrey, Jacob Galan and Jackson Beem were the 2023 recipients of free laptops from ECLP.